Cryogenic processor

A Cryogenic processor is a unit designed to cool an object to ultra-low temperatures (usually around −300°F / −150°C) at a moderated rate in order to prevent thermal shock to the components being treated. The first commercial unit was developed by Ed Busch in the late 1960s.[1] The development of programmable [2]microprocessor controls allowed the machines to follow temperature profiles that greatly increased the effectiveness of the process. Some manufacturers make cryogenic processors with home computers to define the temperature profile.

Before programmable controls were added to control cryogenic processors, the "treatment" process of an object was done manually by immersing the object in liquid nitrogen.[1] This normally caused thermal shock to occur within an object, resulting in cracks to the structure. Modern cryogenic processors measure changes in temperature and adjust the input of liquid nitrogen accordingly to ensure that only fractional changes in temperature occur over a long period of time. Their temperature measurements and adjustments are condensed into "profiles" that are used to repeat the process in a certain way when treating for similarly grouped objects.

The general processing cycle for modern cryogenic processors occurs within a three-day time window, with 24 hours to reach the optimal minimum temperature for a product, 24 hours to hold at the minimum temperature, and 24 hours to return to room temperature. Depending on the product, some items will be heated in an oven to higher temperatures. Some processors are capable of providing both the negative and positive extreme temperatures, although separate units (a cryogenic processor and a dedicated oven) can sometimes produce better results depending upon the application.

The optimal minimum temperatures for objects, as well as the hold times involved, are determined utilizing different research methods and are backed by analysis of the product to determine the optimum procedure for a particular product. As new metals are used in different combinations for newer products on the market, processing profiles may change accordingly to accommodate. Furthermore, thermal profiles may undergo change from the results of case studies produced by a manufacturer or client of cryogenic services. When a cryogenic processor is manufactured, the thermal profiles for the year of manufacture will be included. Alternatively, profiles from when the processor model was first engineered, which may be outdated. Outdated profiles may be included with a processor as the manufacturer does not have adequate funding to perform the necessary ongoing research.

To find thermal profiles for cryogenics, a number of companies maintain thermal profiles of various products that are updated for accuracy at regular intervals according to ongoing research, including data from independent trials and studies. However, obtaining these profiles can be problematic if they are not used for educational purposes (mainly institutional research), as they typically only provide the updated profiles to their longtime "service center" partners.

Cryogenic processors have substantially changed the field of cryogenics. Previously, cryogenics was largely theoretical, with inconsistent results from incremental improvements. Ongoing research may also improve the accuracy temperature treatment profiles, as well as the efficiency of hardware and associated control systems.